Optimizing Thermal Management for SolidRun Boards in High-Load Environments

General Discussion
1

Hello

I have been using SolidRun’s ARM-based boards for edge computing projects but I’ve encountered thermal management challenges when running resource-intensive tasks. The device tends to overheat; leading to performance throttling and occasional system instability. :innocent:

I’m curious about effective cooling solutions tailored to SolidRun boards. Has anyone experimented with custom heatsinks, active cooling systems, or thermal paste enhancements to improve heat dissipation? :thinking: Additionally; are there firmware-level tweaks or power management settings that can help mitigate overheating without sacrificing performance? :thinking: Checked SolidRun Documentation Golang Course related to this and found it quite informative.

If there’s a comprehensive guide / documentation on thermal management for SolidRun hardware, I’d greatly appreciate it. Any tips or shared experiences from the community would be invaluable.

Thank you !! :slightly_smiling_face:

2

specifically which products are you referring to? Most the IoT lineup should out of the box be optimized for our boards and heatsinks regarding thermal designs. If you are using a custom design we are more than happy to work with you to optimize the thermal management further.